Meet the demand for large capacity production of solar cells and silicon
wafers. Double table construction enables the cutting of four ingots
at once.
The T-8252B is a wire cutting machine developed specially for use with diamond wire and makes extensive use of original Toyo technology aimed at taking maximum advantage of the benefits offered by diamond-wire cutting. It features a two-level upper and lower cutting system capable of simultaneously cutting two 500 mm long silicon ingots with a diameter of 156 mm. It also has four wire guides -- top, bottom, left and right -- and uses Toyo's original Separate Wire Web system that consists of two independent wire webs, one used for the upper level and one for the lower. This next-generation wire cutting machine includes features such as high-output motors as well as bobbins and pulleys positioned to prevent wire twisting and skewing, allowing high levels of productivity at least double those of conventional wire cutting machines. It also offers exceptional precision of 10 µm or less of TTV at a high cutting rate of 1 mm per minute, as well as excellent yields of 98% or mor.
Main
Specifications