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November 21,
2003 |
TOYO Participates In The "SEMICON Japan 2003"
Toyo Advanced Technologies Co., Ltd. will participate in the "SEMICON
Japan 2003" to be held at Makuhari Messe in Chiba Prefecture, Japan,
from December 3 through 5.
Toyo will make a strong presentation of their advanced technology to slice
any materials needed for IT industry, by showing work pieces and graphic
panels.
* Exhibition is over. Thank you for visiting our booth.
| Exhibit Dates | December 3(Wed)-5(Fri),2003 10:00-17:00 |
| Venue | Makuhari Messe (Nippon Convention Center) |
| Booth | HALL2-A904 |
| Exhibits | - Wire Saw E450E-12H/E450E-12
- Wire Saw E500SD/E400SD
- Wire Saw E300G-6
- Slicing Machines
- Wafer Surface Grinder |
| Sponsor | SEMI (Semiconductor Equipment and Materials International) |
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