TWG-300 Diamond wire cutting machine
This mode is a diamond wire cutting machine designed for sapphire, SiC, and GaN.
The TWG-300 is a wire cutting machine developed predicated on the use of fixed abrasive grains. With the adoption of the technology that unleashes the performance of diamond wires, it achieves the following for a sapphire ingot with a diameter of 4 inches.
 Double productivity (half the time for the conventional machines)
 Highly accurate TTV of 10 µm and BOW of 10 µm
 Low running costs: wire usage of 15 m/piece
The TWG-300 is newly equipped with a shaking column that shakes the column that retains the wire guide axes, allowing efficient cutting of difficult-to-cut materials. In addition to the basic robust structure, the model has adopted a high-rigidity structure that has a column integrated with a swing mechanism to achieve improved entire rigidity. Besides, it is designed to maximize the performance of diamond wires, for example, with a twist-free wire control mechanism that prevents the wire from twisting or running obliquely and a tension control mechanism that keeps the wire tension constant. Based on this design, it is equipped with a high-output servomotor to provide fast and accurate cutting even under high load, achieving high-speed cutting with a wire travel rate of 1,500 m per minute and high-speed reciprocating cutting with an acceleration/deceleration rate of 1.5 seconds. It also includes a variable profile control feature that allows you to specify various settings, such as the wire travel rate and swing speed, according to the cutting position. With these features, the TWG-300 has achieved high productivity, accurate machining, and low running costs.
|Installation dimensions (width x length x height)||mm||1,700×3,505×2,880|
|Maximum ingot size||mm||φ150|
|Number of wire guide axes||Axes||2|
|Maximum ingot length||mm||300|
|Maximum wired travel speed||m/min.||1,500|