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TWP-500DL Fixed-abrasive-grain wire cutting machine

This model quickly cuts difficult-to-cut materials such as sapphire, SiC (silicon carbide), GaN (gallium nitride) ingots to provide high productivity.

The TWP-500DL is a wire cutting machine developed predicated on the use of diamond wires; in every part, it uses our proprietary technology that makes the most of the features of fixed abrasive grains. It is designed to cut two wires so that two silicon ingots of 156 mm x 500 mm length can be placed in the upper and lower stages. It uses a separate-wire- web system, an original scheme that, with four wire guides placed at upper, bottom, left, and right locations, forms two webs with one wire separately wrapped around the upper and bottom stages. In addition, it uses a bobbin and pulley to prevent the wire from twisting or running obliquely and includes a high-output motor. This resulted in the productivity more than two times that of conventional wire cutting machines, a highly accurate TTV of less than 10 µm even when the cutting rate is as high as 1 mm per minute, and a high yield of 98% or more. With these features, it is a next-generation wire cutting machine.

Main Specifications

TWP-500DL
Installation dimensions (width x length x height) mm 1,860×4,200×2,590
Maximum ingot size mm φ156
Number of wire guide axes Axes 4
Maximum ingot length mm 500 x 2 (two stages at upper and bottom locations)
Maximum wired travel speed m/min. 1,500